go to the IGBT and diode modules product page Anonymous asked on Jan 23rd, 2017 in IGBT and diode modules

What measures do we have to take to assure uniform chip pressure of all IGBT chips in the press-pack IGBT module?

Katja Fröhlich, Communications Manager

ABB's answer

Provide sufficient clamping force and surface quality according to datasheets.

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  • Katja Fröhlich

    Katja Fröhlich

    Communications Manager

    Semiconductors

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